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Intel Thermal Solution Cooling Fan/Heatsink for LGA2011 E5-2600 Processors (BXSTS200C)

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Product ID: 4809245
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About the item

  • Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink with fan removed.
  • 2U or larger rack chassis with ducted airflow to heat sink.
  • Pedestal chassis with ducted airflow to heat sink.
  • Max CPU TDP 130W.
  • Compatible Socket: LGA2011.
Intel active boxed combo solution for 2-socket servers/workstations using e5-26xx & e5-16xx processors

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